TECHNOLOGY
技術(shù)研發(fā)
氮化鋁陶瓷材料
氮化鋁陶瓷材料具有優(yōu)良的導(dǎo)熱性能和電絕緣性能，接近于硅的熱膨脹系數(shù)，低介電常數(shù)，耐腐蝕性和高溫下的化學(xué)穩(wěn)定性。被廣泛應(yīng)用于大規(guī)模集成電路基板及封裝材料。
本公司選用高純超細鋁粉，采用自蔓延方法制取的氮化鋁粉體，經(jīng)超細加工后用于生產(chǎn)BAT陶瓷產(chǎn)品及電子器件。
Aluminum nitride materials have very nice electrical resistivity and low dielectric constant and its thermal expansion coefficient closely matches that of silicon.It is stable in hign temperature and corrosion resistance and it is used widely as the plate of integrated circuit and sealing materials.It is also used as the main material for the manufacturing of BAT cermics. We produce our ALN powder with aluminum powder in super quality with a spread method and after extra grinding,ALN powder is obtained.
主要性能見下表
您好，需要我們?yōu)槟鲂┦裁矗?
*注：請務(wù)必信息填寫準確，我們會盡快與你取得聯(lián)系